Sn and Bi whisker growth from SAC0307-Mn07 and SAC0307-Bi1-Mn07 ultra-thin film layers

نویسندگان

چکیده

In the past years, use of low silver content SAC0307 (99Sn0.3Ag0.7Cu wt%) solder alloy grew considerably due to its good soldering quality. latest version this alloy, manganese, and bismuth are used improve further parameters. study, a reliability issue, whisker growth from SAC0307-Mn07 SAC0307-Bi1-Mn07 alloys was investigated. Ultra-thin films (in 100–150 nm thickness) were vacuum evaporated investigated onto Cu substrates. The samples stored at laboratory conditions for 28 days. Whisker followed by scanning electron microscope, ultra-thin film layers structures in focused ion beam cuts. case SAC0307-Mn07, mechanical stress intermetallic layer resulted formation right after deposition. However, Bi addition could increase relaxation ability layer; started only three days evaporation layer. Besides, entirely suppress filament-type whiskers that might cause issues microelectronics. Furthermore, unique phenomenon observed produced mostly Bi–Sn couples.

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ژورنال

عنوان ژورنال: Vacuum

سال: 2021

ISSN: ['0042-207X', '1879-2715']

DOI: https://doi.org/10.1016/j.vacuum.2021.110121